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Entries Tagged as 'Momentum'
Momentum Papers on Google Scholar
April 29th, 2010 · No Comments · Application Engineer
Tags: Momentum
24 GHz SiGe BiCMOS LNA for UWB Automotive Radar by STMicroelectronics
January 5th, 2010 · No Comments · Users Group Paper
Egidio Ragonese & Giuseppe Palmisano of STMicroelectronics & University of Catania present a 3-stage transformer-loaded cascode 24-GHz LNA for Automotive Radar. The transformers use a multi-layer interleaved spiral inductor structure. Momentum EM simulation and optimization of inductance and Q-factor are compared to measurements with Cascade Microtech prober, Vector Network Analyzer (VNA) & Noise Figure Analyser. Layout [...]
60 GHz Low Noise Amplifier Design Methodology in CMOS 65nm by STMicroelectronics
December 17th, 2009 · No Comments · Users Group Paper
Baudouin Martineau of STMicroelectronics gives an excellent overview of the 60 GHz millimeter wave market, applications including WPAN, automotive radar and 94 GHz imaging; semiconductor technology requirements and 65nm CMOS technology specifically; modeling, parametric cells, electromagnetic simulation, Momentum modeling of vertical and horizontal coupled transformers, LNA design methodology, using circuit and EM simulation and optimization.
Millimeter-wave [...]
Tags: 60 GHz·65nm·Amplifier·cascode·CMOS·EM·Harmonic Balance·LNA·mmW·Momentum·MOSFET·radar·SOI·V-Band·WLAN·WPAN
8W X-Band PHEMT PA Design by UMS
December 16th, 2009 · No Comments · Users Group Paper
Monolithic Microwave High Power Amplifiers on GaAs for Phased Array Radar deliver high efficiency for X-band applications. Huet, Bly and Serru of UMS demonstrates the design of a HPA using PHEMT technology.
8W-X-Band-PHEMT-High-Power-Amplifier-Design-UMS
Tags: Amplifier·Class AB·combiner·DRC·GaAs·Gain Compression·Harmonic Balance·Layout·Load Pull·measurements·Momentum·MonteCarlo·optimization·PAE·PDK·PHEMT·Power Amplifier·stability analysis·X-band
BGA Package Simulation
September 6th, 2008 · No Comments · Application Engineer
A BGA package is very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. In a BGA package, the electrical connections are made of solder balls stuck to the bottom of the package. However as the operating frequency and data rate go up, it is [...]
C- & X-Band Microstrip Planar Array Antenna Design
September 6th, 2008 · No Comments · Application Engineer
Planar microstrip patch antennas for communication/radar applications usually require a larger gain (~25 db) that needs more array of patch elements usually 50 plus. In order to accurately characterize the antenna in terms of radiation and return loss the entire antenna structure needs to be simulated. The antenna structure can be either single band, multiband, [...]
QFN Package Optimized for 20 GHz
September 6th, 2008 · No Comments · Application Engineer
QFN (Quad Flat No-Lead) is very popular low cost package for RFIC, MMIC, and RF SiP applications. Most IC vendors use this package for their products. QFN packages perform pretty good up to 15GHz, showing less than -18 dB return loss with a typical package mounting scheme. However new designs require a higher operating frequency [...]