RF Design Tips, Tricks & Tutorials

ADS Users’ RF & Microwave Designs & Applications

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Entries Tagged as 'Application Engineer'

Momentum Papers on Google Scholar

April 29th, 2010 · No Comments · Application Engineer

One visitor to the this site pointed out that there are hundreds of published papers, citations and references to Momentum on Google Scholar. Maybe you can find an application similar to yours.

Google “ADS Momentum”
Google “Agilent Momentum”

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Using EM to Design DGS Structures

February 12th, 2010 · No Comments · Application Engineer

A Defective Ground Structure (DGS) is an intentionally designed defect on a ground plan, which creates additional effective inductance and capacitance.  This technique can be used to design microstrip lines with desired characteristics such as higher impedance, band rejection and slow-wave characteristics, while significantly reducing the footprint of the microstrip structure.  DGS structures are used [...]

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Free DVD: MMIC Design Seminar

February 5th, 2010 · 2 Comments · Application Engineer, Demo/Video

The art of designing MMICs can be achieved with a good design methodology and environment. This MMIC Seminar, available on the web and orderable on DVD, has been designed to provide a complete set of technical material that helps achieve fast and accurate MMIC design.
The technical material included in these seminar style materials will help guide you [...]

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Chinese/English ADS Product Demos

January 11th, 2009 · No Comments · Application Engineer, Demo/Video

Probably many of you who know Chinese are aware of this website already [www.agilentads.com], but for English speakers/readers this site has hundreds of ADS feature demos that might be of interest to you because they also contain English bubble text in addition to the Chinese text. The best way for English readers to view the site [...]

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BGA Package Simulation

September 6th, 2008 · No Comments · Application Engineer

A BGA package is very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. In a BGA package, the electrical connections are made of solder balls stuck to the bottom of the package. However as the operating frequency and data rate go up, it is [...]

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C- & X-Band Microstrip Planar Array Antenna Design

September 6th, 2008 · No Comments · Application Engineer

Planar microstrip patch antennas for communication/radar applications usually require a larger gain (~25 db) that needs more array of patch elements usually 50 plus. In order to accurately characterize the antenna in terms of radiation and return loss the entire antenna structure needs to be simulated. The antenna structure can be either single band, multiband, [...]

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QFN Package Optimized for 20 GHz

September 6th, 2008 · No Comments · Application Engineer

QFN (Quad Flat No-Lead) is very popular low cost package for RFIC, MMIC, and RF SiP applications. Most IC vendors use this package for their products. QFN packages perform pretty good up to 15GHz, showing less than -18 dB return loss with a typical package mounting scheme. However new designs require a higher operating frequency [...]

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Welcome!

January 7th, 2008 · No Comments · Application Engineer

Hi. Welcome to RF Design Tips, Tricks and Tutorials. I’ve created this site as a resource for people using ADS, to learn from others and to share your accomplishments. I’ve kicked off this site with a few of the best papers from the ADS Users Group Meetings in 2009. And I invite you to contribute your [...]

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