A BGA package is very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. In a BGA package, the electrical connections are made of solder balls stuck to the bottom of the package. However as the operating frequency and data rate go up, it is [...]
Entries from September 6th, 2008
C- & X-Band Microstrip Planar Array Antenna Design
September 6th, 2008 · No Comments · Application Engineer
Planar microstrip patch antennas for communication/radar applications usually require a larger gain (~25 db) that needs more array of patch elements usually 50 plus. In order to accurately characterize the antenna in terms of radiation and return loss the entire antenna structure needs to be simulated. The antenna structure can be either single band, multiband, [...]
QFN Package Optimized for 20 GHz
September 6th, 2008 · No Comments · Application Engineer
QFN (Quad Flat No-Lead) is very popular low cost package for RFIC, MMIC, and RF SiP applications. Most IC vendors use this package for their products. QFN packages perform pretty good up to 15GHz, showing less than -18 dB return loss with a typical package mounting scheme. However new designs require a higher operating frequency [...]